Introduction

Atomic and close-to-atomic scale manufacturing (ACSM) is the leading trend of future manufacturing development. Understanding the unique behaviors, manufacturing mechanisms at the atomic scale and developing new methods, equipment and instruments is vital for the ACSM process. Atomic layer deposition (ALD) as an atomic-level bottom-up and surface sensitive functionalization ASCM technique, has drawn more and more attentions during the recent years. The chemical, conformal, self-limiting and accuracy characteristics of ALD are now leading the booming of optical, electronic, energetic, catalytic mechanical as well as other emerging novel functional devices, applications and systems.

The aim of this special theme is to provide a forum for researchers and practitioners to present and review the state-of-the-art development, premier challenges and foresight visions in ACSM, with an emphasis on ALD fundamentals, new processes, new tools and new applications. ACSM parameters with atomic scale, atomic precision, large area, complex geometry and high performance particularly with ALD, are highly preferred.

Possible topics, within this scope, include but are not limited to:

Emerging and novel applications of atomic and close-to-atomic scale manufacturing

•    New ALD processes and precursors for emerging applications

•    Simulation, modeling, and theory of new growth

•    Characterizations and in-situ analysis during ALD growth

•    Plasma and other energy-enhanced ALD methods

•    Spatial atomic layer deposition for large-scale and mass production

•    Atomic layer etching process and fabrication

•    Applications in sensors

•    Applications in optics and displays

•    Applications in flexible and organic electronics

•    Applications in energy storage and catalysis

•    Applications in medical and biological systems

•    Applications in environment remediation

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