Special Issue on ‘Multiscale Manufacturing towards Flexible Hybrid Electronics’
Guest Editor: Huazhong University of Science and Technology, China Email: yahuang@hust.edu.cn |
Flexible hybrid electronics integrate functional materials/components in traditional and unusual electronic architectures on flexible/stretchable/curved substrates to yield systems that have unique properties, unavailable to conventional, wafer-based devices, e.g. flexible display, smart sensing skins for aircrafts and robots, epidermal electronics for healthcare and human-machine interaction, and so on. This new type of electronics devices represents a burgeoning technology that offers the electrical functions of conventional, rigid wafer-based microelectronics but with the ability to be stretched, compressed, twisted, bent, and conformed onto arbitrary shapes. It is believed that much more effort should be drawn to bring about new strategies to overcome the limitation of concurrent 2D planar photolithography. Therefore, groundbreaking multiscale manufacturing technologies are highly demanded for flexible/stretchable/curved electronics.
The aim of this special theme is to provide a forum for researchers and practitioners to present and review the state-of-the-art development, premier challenges and foresight visions in multiscale manufacturing towards flexible hybrid electronics, with an emphasis on scaling effects, new processes, new tools and new applications. Multiscale manufacturing with ultrahigh resolution, large area, and complex surface are preferred.
Possible topics, within this scope, include but are not limited to:
Inkjet Printing for Flexible/Stretchable/Curved Electronics
Transferring Printing for Flexible/Stretchable/Curved Electronics
Nano/micro Imprinting for Flexible/Stretchable/Curved Electronics
Self-assembly Manufacturing for Flexible/Stretchable/Curved Electronics
Laser Fabrication for Flexible/Stretchable/Curved Electronics
Photolithography for Flexible/Stretchable/Curved Electronics
Solution-Processable Fabrication for Flexible/Stretchable/Curved Electronics
Hybrid Integration for Flexible/Stretchable/Curved Electronics
3D Printing/Additive Manufacturing of 3D Soft Electronics/Bioelectronics
Laser Lift-Off for Flexible Electronics
Massive Transfer for MicroLED Display
Roll-to-Roll Manufacturing for Flexible Electronics
Scalable Fabrication for Flexible Electronics
Ultrathin Encapsulation Technology for Flexible Electronics
Conformal Micro/Nano-Manufacturing on Curved Surface
Surface Modification/Functionalization for Thin Film/Substrate
Please submit your papers in light of following important dates for the special theme:
Submission deadline: 20 January 2021
First round of reviews: 5 February 2021
Final submission and decision: 20 February 2021
Publication: April-July 2021
Submission portal at IJEM
https://mc04.manuscriptcentral.com/ijem-caep
Call for Paper
https://v2.fangcloud.com/share/f5b805653a4b70b50097bfbfef