Special Issue on ‘Materials for thermal applications: from room temperature to high temperature’
Guest Editor:Dr. Jean-François Silvain CNRS Senior Researcher University of Bordeaux, France Email: jean-francois.silvain@icmcb.cnrs.fr Guest Editor: Pr. Jean-Marc Heintz Professor at Bordeaux INP Guest Editor:Pr. Jean-Marc Heintz Professor at Bordeaux INP Guest Editor:Dr. Catherine Debiemme-Chouvy CNRS Senior Researcher |
Introduction
Thermal management is a key issue to increase the lifetime of devices which work under different atmospheres and temperatures.Examples of such materials are high temperature composite materials for mechanical applications, intermediate temperature composite materials with controlled thermal conductivity and low temperature bonding materials for electronic applications.Development of such materials has led to international research efforts in discovery, design, and manufacturing methods focused on the materials fabrication & testing, and theoretical modelling & simulation of new materials.
The aim of this special issue is to provide a forum for researchers to present and review the state-of-the-art development, challenges, and foresight visions in multiscale manufacturing of materials for thermal applications with an emphasis on processing and characterization, as well as the recent progress in developing new processes, and new applications.
Possible topics, within this scope, include but are not limited to:
Materials for extreme environments (C/C, SiC/SiC, derived MAX phases)
Advanced thermal and environmental barrier coatings (processing, properties, and applications)
Oxide and non-oxide ceramic materials for mechanical applications
Glasses and glassy metals
Metal matrix composites with controlled thermal conductivity and coefficient of thermal expansion
Materials in nuclear energy applications
Thermal conductive fillers
Low temperature polymer-based materials
Low temperature bonding materials
Materials for thermal energy storage in building applications (phase change materials, …)
Additive manufacturing of materials for thermal applications
New fabrication process (FAST, CVD, laser, plasma, arc source, …)
Modelling and Simulations
Important dates
Please submit your papers in light of following important dates for the special issue:
Submission deadline: 30 June 2022
First round of reviews: 31 July 2022
Final submission and decision: 31 August 2022
Publication: August–October 2022
Free & Professional Services
Open access free of charge
Free widest possible global promotion for your research
Free and high-quality figure editing
Free and high-quality references formatting
Submission portal at IJEM
https://mc04.manuscriptcentral.com/ijem-caep
Call for Paper
https://v2.fangcloud.com/share/55780750f95be127bfe414a2c6