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Special Issue on ‘Materials for thermal applications: from room temperature to high temperature’


Guest Editor:Dr. Jean-François Silvain

CNRS Senior Researcher

University of Bordeaux, France

Email: jean-francois.silvain@icmcb.cnrs.fr

Guest Editor: Pr. Jean-Marc Heintz

Professor at Bordeaux INP

Guest Editor:Pr. Jean-Marc Heintz

Professor at Bordeaux INP

Guest Editor:Dr. Catherine Debiemme-Chouvy

CNRS Senior Researcher


Introduction

Thermal management is a key issue to increase the lifetime of devices which work under different atmospheres and temperatures.Examples of such materials are high temperature composite materials for mechanical applications, intermediate temperature composite materials with controlled thermal conductivity and low temperature bonding materials for electronic applications.Development of such materials has led to international research efforts in discovery, design, and manufacturing methods focused on the materials fabrication & testing, and theoretical modelling & simulation of new materials.

The aim of this special issue is to provide a forum for researchers to present and review the state-of-the-art development, challenges, and foresight visions in multiscale manufacturing of materials for thermal applications with an emphasis on processing and characterization, as well as the recent progress in developing new processes, and new applications.


Possible topics, within this scope, include but are not limited to:

   Materials for extreme environments (C/C, SiC/SiC, derived MAX phases)

  •    Advanced thermal and environmental barrier coatings (processing, properties, and applications)

  •    Oxide and non-oxide ceramic materials for mechanical applications

  •    Glasses and glassy metals

  •    Metal matrix composites with controlled thermal conductivity and coefficient of thermal expansion

  •    Materials in nuclear energy applications

  •    Thermal conductive fillers

  •    Low temperature polymer-based materials

  •    Low temperature bonding materials

  •    Materials for thermal energy storage in building applications (phase change materials, …)

  •    Additive manufacturing of materials for thermal applications

  •    New fabrication process (FAST, CVD, laser, plasma, arc source, …)

  •    Modelling and Simulations


Important dates

Please submit your papers in light of following important dates for the special issue:

   Submission deadline: 30 June 2022

   First round of reviews: 31 July 2022

   Final submission and decision: 31 August 2022

   Publication:   August–October 2022


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Submission portal at IJEM

https://mc04.manuscriptcentral.com/ijem-caep


Call for Paper

https://v2.fangcloud.com/share/55780750f95be127bfe414a2c6



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