Special Issue on ‘Micro-nano Device Fabrication and Neuromorphic Applications’
Guest Editor: Qing Wan, Professor Nanjing University, Email: wanqing@nju.edu.cn |
Guest Editor: Da-Shan Shang, Professor Institute of Microelectronics, Chinese Academy of Sciences Email: shangdashan@ime.ac.cn |
Guest Editor: Jie Jiang, Associate Professor Central South University, Email: jiangjie@csu.edu.cn |
Introduction
Nowadays, the digital computers are based on von Neumann architecture, where the memory and processor are physically separated. However, this conventional von Neumann architecture is becoming increasingly inefficient when it meets complicated computation or real-time processing of visual/speech recognition. At the same time, traditional silicon technology is reaching the physical limit and meeting the Moore's law bottleneck. Therefore, the micro-nano devices with extreme fabrication processes and emerging functions are highly significant to overcome this challenge. On the other hand, the human brain is a highly parallel, fault-tolerance, energy-efficient, and event-driven information processing system, which is fundamentally different from the conventional von Neumann computer. Therefore, the hardware implementation of biological synapses with the emerging micro-nano devices is of great importance for realizing brain-like computational systems, which holds high promise to break the current bottlenecks of device process.
The aim of this special issue is to provide a forum to review neuromorphic information materials and devices. Original work on new materials, new structures, new applications and novel device mechanisms for neuromorphic visual, tactile, auditory, olfactory; artificial neural networks and intelligent algorithms are also strongly encouraged.
Possible topics include but are not limited to:
Micro/nano-fabrication of functional interfaces and neuromorphic devices
Emerging device structures and neuromorphic applications
Memristor fabrication process and array integration
Oxide thin-film transistor and neuromorphic applications
2D material-based FET and neuromorphic applications
Flexible transistor technology and neuromorphic applications
Machine learning and artificial neural networks
Important dates
Please submit your papers in light of the following important dates for the special issue:
Submission deadline: 31 May 2023
First round of reviews: 30 June 2023
Final submission and decision: 31 August 2023
Publication: October – December 2023
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Submission portal at International Journal of Extreme Manufacturing:
https://mc04.manuscriptcentral.com/ijem-caep