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Volume 3 Issue 3
May  2021
Article Contents

Chen Y, Chen Y H, Long J Y, Shi D C, Chen X, Hou M X, Gao J, Liu H L, He Y B, Fan B et al. 2021. Achieving a sub-10 nm nanopore array in silicon by metal-assisted chemical etching and machine learning. Int. J. Extrem. Manuf. 3, 035104.
Citation: Chen Y, Chen Y H, Long J Y, Shi D C, Chen X, Hou M X, Gao J, Liu H L, He Y B, Fan B et al. 2021. Achieving a sub-10 nm nanopore array in silicon by metal-assisted chemical etching and machine learning. Int. J. Extrem. Manuf. 3, 035104.

Achieving a sub-10 nm nanopore array in silicon by metal-assisted chemical etching and machine learning


doi: 10.1088/2631-7990/abff6a
More Information
  • Publish Date: 2021-05-24
  • Solid-state nanopores with controllable pore size and morphology have huge application potential. However, it has been very challenging to process sub-10 nm silicon nanopore arrays with high efficiency and high quality at low cost. In this study, a method combining metal-assisted chemical etching and machine learning is proposed to fabricate sub-10 nm nanopore arrays on silicon wafers with various dopant types and concentrations. Through a SVM algorithm, the relationship between the nanopore structures and the fabrication conditions, including the etching solution, etching time, dopant type, and concentration, was modeled and experimentally verified. Based on this, a processing parameter window for generating regular nanopore arrays on silicon wafers with variable doping types and concentrations was obtained. The proposed machine-learning-assisted etching method will provide a feasible and economical way to process high-quality silicon nanopores, nanostructures, and devices.

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Achieving a sub-10 nm nanopore array in silicon by metal-assisted chemical etching and machine learning

doi: 10.1088/2631-7990/abff6a
  • 1 State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechnical Engineering, Guangdong University of Technology, Guangzhou 510006, People's Republic of China
  • 2 School of Engineering, The Chinese University of Hong Kong, Shatin, Hong Kong
  • 3 Guangdong ADA Intelligent Equipment Ltd, Foshan 510006, People's Republic of China
  • 4 Institute of Business Analysis and Supply Chain Management, College of Management, Shenzhen University, Shenzhen, People's Republic of China
  • 5 School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332, United States of America

Abstract: 

Solid-state nanopores with controllable pore size and morphology have huge application potential. However, it has been very challenging to process sub-10 nm silicon nanopore arrays with high efficiency and high quality at low cost. In this study, a method combining metal-assisted chemical etching and machine learning is proposed to fabricate sub-10 nm nanopore arrays on silicon wafers with various dopant types and concentrations. Through a SVM algorithm, the relationship between the nanopore structures and the fabrication conditions, including the etching solution, etching time, dopant type, and concentration, was modeled and experimentally verified. Based on this, a processing parameter window for generating regular nanopore arrays on silicon wafers with variable doping types and concentrations was obtained. The proposed machine-learning-assisted etching method will provide a feasible and economical way to process high-quality silicon nanopores, nanostructures, and devices.

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