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Volume 2 Issue 1
Mar.  2020
Article Contents

Zhao J, Yang S M, Xue C F, Wang L S, Liang Z F, Zhang L, Wang Y, Wu Y Q, Tai R Z. 2020. The recent development of soft x-ray interference lithography in SSRF. Int. J. Extrem. Manuf. 2, 012005.
Citation: Zhao J, Yang S M, Xue C F, Wang L S, Liang Z F, Zhang L, Wang Y, Wu Y Q, Tai R Z. 2020. The recent development of soft x-ray interference lithography in SSRF. Int. J. Extrem. Manuf. 2, 012005.

The recent development of soft x-ray interference lithography in SSRF


doi: 10.1088/2631-7990/ab70ae
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  • Publish Date: 2020-03-01
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    This paper introduces the recent progress in methodologies and their related applications based on the soft x-ray interference lithography beamline in the Shanghai synchrotron radiation facility. Dual-beam, multibeam interference lithography and Talbot lithography have been adopted as basic methods in the beamline. To improve the experimental performance, a precisereal-time vibration evaluation system has been established; and the lithography stability has been greatly improved. In order to meet the demands for higher resolution and practical application, novel experimental methods have been developed, such as high-order diffraction interference exposure, high-aspect-ratio and large-area stitching exposure, and parallel direct writing achromatic Talbot lithography. As of now, a 25 nm half-pitch pattern has been obtained; and a cmexposure area has been achieved in practical samples. The above methods have been applied to extreme ultraviolet photoresist evaluation, photonic crystal and surface plasmonic effect research, and so on.

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The recent development of soft x-ray interference lithography in SSRF

doi: 10.1088/2631-7990/ab70ae
  • 1 Shanghai Synchrotron Radiation Facility, Shanghai Advanced Research Institute, CAS, Shanghai, People’s Republic of China
  • 2 Shanghai Institute of Applied Physical, CAS, Shanghai, People’s Republic of China

Abstract: 

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This paper introduces the recent progress in methodologies and their related applications based on the soft x-ray interference lithography beamline in the Shanghai synchrotron radiation facility. Dual-beam, multibeam interference lithography and Talbot lithography have been adopted as basic methods in the beamline. To improve the experimental performance, a precisereal-time vibration evaluation system has been established; and the lithography stability has been greatly improved. In order to meet the demands for higher resolution and practical application, novel experimental methods have been developed, such as high-order diffraction interference exposure, high-aspect-ratio and large-area stitching exposure, and parallel direct writing achromatic Talbot lithography. As of now, a 25 nm half-pitch pattern has been obtained; and a cmexposure area has been achieved in practical samples. The above methods have been applied to extreme ultraviolet photoresist evaluation, photonic crystal and surface plasmonic effect research, and so on.

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