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[Special Theme]Special Theme on “Multiscale Manufacturing towards Flexible Hybrid Electronics” at IJEM

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Release Date: 2022-01-13 Visited: 

Special Theme on

 “Multiscale Manufacturing towards Flexible Hybrid Electronics”at IJEM

 

Front cover picture:

Conformal manufacturing of soft deformable sensors on the curved surface.From article 042001(2021) by Wanqing Zhang et al in this special issue.


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Guest Editor:

Prof. YongAn Huang

Huazhong University of Science and Technology


Article Content

Review: 

Conformal manufacturing of soft deformable sensors on the curved surface

Wanqing Zhang, Ling Zhang, Yabin Liao and Huanyu Cheng*

 

Professor Huanyu Cheng's research group at the Pennsylvania State University: In this article, the authors provide a comprehensive summary that includes various advanced transfer printing and direct conformal printing techniques, followed with applications to fabricate sensors and devices in conformal manufacturing.  Next, recent advances in conformal electronics are discussed.  In the end, the authors highlight the existing challenges and a small fraction of opportunities for future development of conformal manufacturing. Figure 1 shows the recent advancement of conformal manufacturing of soft deformable devices on curved surfaces.

Link: https://iopscience.iop.org/article/10.1088/2631-7990/ac1158

 

Paper:

Programmable robotized ‘transfer-and-jet’ printing for large, 3D  curved electronics on complex surfaces

Yongan Huang*,  Hao Wu,Chen Zhu et al.

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Professor Yongan Huang’s research group at Huazhong University of Science and Technology: A novel robotized "transfer and jet" printing strategy has been proposed to realize multi-process combinations through programmable methods, which integrates a series of core technologies and methods such as "2D-3D" mapping, conformal printing, laser lift-off, curved surface transfer printing, etc. It can satisfy different material, shape, size, function, performance of electronic system integrations, break through the limitations of small-area, planar from electronic devices fabrication, and provide a powerful new and effective solution for assembling curved electronics, especially for R&D production that integrates design, testing, and manufacturing, and can significantly shorten the production cycle.

Link: https://iopscience.iop.org/article/10.1088/2631-7990/ac115a

 

Paper:

Guiding magnetic liquid metal for flexible circuit

Chengjun Zhang, Qing Yang, Jiale Yong, Chao Shan, Jingzhou Zhang, Xun Hou, Feng Chen*

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Professor Feng Chen’s research group at Xi’an Jiaotong University: In this article, the authors proposed a method to fabricate supermetalphobic surface on the flexible silicone substrate by the femtosecond laser. Magnetic LM (MLM) droplet can be functionally manipulated on the surface of silicone substrate to achieve LM pattern printing and repair by tuning the wettability of the LM. The printed LM circuit has a uniform surface and can be recycled in the Ethanol solution for reuse.

Link: https://iopscience.iop.org/article/10.1088/2631-7990/abeda3

 

Paper: 

A thermal actuated switchable dry adhesive with high reversibility for transfer printing

Shun Zhang, Hongyu Luo, Suhao Wang, Zhou Chen, Shuang Nie, Changying Liu, Jizhou Song*

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Professor Jizhou Song’s research group at Zhejiang University: The authors report a robust design of a thermal actuated switchable dry adhesive, which features a stiff sphere embedded in a thermally responsive shape memory polymer (SMP) substrate and encapsulated by an elastomeric membrane. This construct bypasses the unfavorable micro- and nano-fabrication processes and yields an adhesion switchability of over 1000 by combining the peel-rate dependent effect of the elastomeric membrane and the thermal actuation of the sub-surface embedded stiff sphere. Experimental and numerical studies reveal the underlying thermal actuated mechanism and provide insights into the design and operation of the switchable adhesive. Demonstrations of this concept in stamps for transfer printing of fragile objects, such as silicon wafers, silicon chips, and inorganic micro-LED chips, onto challenging non-adhesive surfaces illustrate its potential in heterogeneous material integration applications, such as flexible electronics manufacturing and deterministic assembly.

Link: https://iopscience.iop.org/article/10.1088/2631-7990/abff69

 

ABOUT IJEM

International Journal of Extreme Manufacturing is a new multidisciplinary journal uniquely covering the areas related to extreme manufacturing. The journal is devoted to publishing original research of the highest quality and impact in the areas related to extreme manufacturing, ranging from fundamentals to process, metrology, conditions, environments, and system integration. IJEM is currently indexed by SCIEEIScopusCASProQuestJSTJ-GateCNKIINSPECDOAJ, and many other world-famous databases, and reaches the high-quality scientific journals in mechanical engineering (T2).

 

Website:https://iopscience.iop.org/journal/2631-7990 

Submission portal: https://mc04.manuscriptcentral.com/ijem-caep 

Contact us:office@ijem.org.cn 


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