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Volume 1 Issue 2
Dec.  2019
Article Contents

Liu Y, Xiong W, Li D W, Lu Y, Huang X et al. Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures. Int. J. Extrem. Manuf. 1, 025001 (2019).
Citation: Liu Y, Xiong W, Li D W, Lu Y, Huang X et al. Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures. Int. J. Extrem. Manuf. 1, 025001 (2019).

Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures


doi: 10.1088/2631-7990/ab17f7
More Information
  • Publish Date: 2019-12-05
  • Three-dimensional (3D) electrically conductive micro/nanostructures are now a key component in a broad range of research and industry fields. Direct laser writing by two-photon polymerization (TPP) has been established as one of the most promising methods for achieving 3D fabrication in micro/nanoscales, due to its ability to produce arbitrary and complex 3D structures with sub wavelength resolution. However, the lack of TPP-compatible and functional materials represents a significant barrier to realizing the functionality of the fabricated devices, such as high electrical conductivity, high environmental sensitivity, and high mechanical strength, etc. In this work, a novel method was developed to realize metallic 3D micro/nanostructures with silver-thiol-acrylate composites via TPP followed by femtosecond laser nanojoining. Complex 3D micro/nanoscale conductive structures have been successfully fabricated with ~200 nm resolution. The loading of silver nanowires (AgNWs) and joining of junctions successfully enhanced the electrical conductivity of the composites from insulating to 92.9 S m-1 at room temperature. Moreover, for the first time, a reversible switching to a higher conductivity was observed, up to ~103-105 S m-1 at 523 K. The temperature-dependent conductivity of the composite was analyzed using the variable range hopping and thermal activation models. The as-developed nanomaterial assembly and joining method in this study paves a way toward a wide range of device applications, including 3D electronics, sensors, memristors, micro/nanoelectromechanical systems (MEMS/NEMS), and biomedical devices, etc.
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Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures

doi: 10.1088/2631-7990/ab17f7
  • 1 Department of Electrical and Computer Engineering, University of Nebraska-Lincoln, Lincoln, NE 68588-0511, United States of America;
  • 2 Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan 430074, People’s Republic of China;
  • 3 School of Mechanical Engineering, Beijing Institute of Technology,Beijing, 100081, People’s Republic of China;
  • 4 Institut de Chimie de la Matière Condensée de Bordeaux, Avenue du Docteur Albert Schweitzer, F-33608 Pessac Cedex, France

Abstract: 

Three-dimensional (3D) electrically conductive micro/nanostructures are now a key component in a broad range of research and industry fields. Direct laser writing by two-photon polymerization (TPP) has been established as one of the most promising methods for achieving 3D fabrication in micro/nanoscales, due to its ability to produce arbitrary and complex 3D structures with sub wavelength resolution. However, the lack of TPP-compatible and functional materials represents a significant barrier to realizing the functionality of the fabricated devices, such as high electrical conductivity, high environmental sensitivity, and high mechanical strength, etc. In this work, a novel method was developed to realize metallic 3D micro/nanostructures with silver-thiol-acrylate composites via TPP followed by femtosecond laser nanojoining. Complex 3D micro/nanoscale conductive structures have been successfully fabricated with ~200 nm resolution. The loading of silver nanowires (AgNWs) and joining of junctions successfully enhanced the electrical conductivity of the composites from insulating to 92.9 S m-1 at room temperature. Moreover, for the first time, a reversible switching to a higher conductivity was observed, up to ~103-105 S m-1 at 523 K. The temperature-dependent conductivity of the composite was analyzed using the variable range hopping and thermal activation models. The as-developed nanomaterial assembly and joining method in this study paves a way toward a wide range of device applications, including 3D electronics, sensors, memristors, micro/nanoelectromechanical systems (MEMS/NEMS), and biomedical devices, etc.

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